Heat-dissipating silicone adhesive
Gelest's PP2-TC01 is a non-flowing two-component thermally conductive silicone suitable for bonding electronic devices that require heat dissipation.
Features and Benefits • Thermal conductivity • Soft, compressible • Self-adhesive • Non-flowable and thermosetting • No curing by-products • Addition curing with platinum catalyst
- Company：アヅマックス
- Price：Other
